FEA simulation work is performed for a variety of reasons, including design of components or assemblies, evaluation and improvement of prototype designs, virtual testing, validation of prototype designs, root case failure analysis, and problem troubleshooting.
MSI applies FEA to structural, vibration, dynamics, rotordynamic, thermal, acoustic, electromagnetic, corrosion, and multiphysics problems, all for a wide variety of materials, including non-homogenous, nonlinear, and anisotropic. MSI uses in-house supercomputing capabilities to handle the most complex engineering problems from mesh through solution.
Finite Element Analysis is a numerical method for solving engineering and mathematical physics problems. The analytical solution of these problems generally requires the solution to boundary value problems for partial differential equations. The finite element method formulation of the problem results in a system of algebraic equations. The method approximates the unknown function over the domain of the problem by subdividing a large system into smaller, simpler parts called finite elements. The simple equations that model these finite elements are then assembled into a larger system of equations that models the entire problem.
The types of problems MSI addresses with FEA include linear and non-linear capability, stress, fatigue (LCF/HCF), vibration, and natural frequency (including bladed disc), heat transfer (steady and transient), acoustics, ASME Boiler and Pressure Vessel Code Sect. III or VIII, cracking, fracture mechanics, 3D contact with friction, plastic flow, overload, buckling, and creep. This includes complex interactions and side effects. For example, a predicted temperature field can be applied to a structural model to check how thermal growth affects stress. Magnetic fields result in eddy currents that generate heat which deforms structures. Acoustic cavity resonance can vibrate a structure to failure. Aerodynamics predicted in a computational fluid dynamics analysis cause external pressures on a wing that lead to structural deformation of the wing.
Before expensive prototypes were manufactured and tested, the circuit board system was analytically evaluated in an effort to identify weak points so that they could be redesigned.