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To condense development schedules, trim expenses, and resolve reliability and manufacturing problems for electronic systems
manufacturers, Mechanical Solutions, Inc. (MSI) performs “virtual testing” by applying advanced techniques of mechanical analysis. Substantial experience together with state-of-the-art,
multi-disciplinary analytical tools distinguish MSI from the competition.
When applied early in the design process, advanced Finite Element Analysis (FEA), also occasionally augmented with
Computational Fluid Dynamics (CFD) analysis, more than pays for itself by eliminating the outdated, costly, and time consuming “trial and error testing”
methodology of product development. MSI has used advanced analytical tools to troubleshoot and to quickly resolve product issues that were associated with thermal anomalies, premature
component failure, and noise. MSI specializes in solving challenging non-linear and multi-disciplinary problems, e.g. those which feature the combined interaction of fluids, thermal, and mechanical
phenomena, in a timely and cost-effective manner.
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Currently, the Reduction of Hazardous Substances in Electrical and Electronics Equipment (RoHS) legislation provides an excellent example of the beneficial application of MSI’s “virtual testing”
capabilities. A primary RoHS initiative is the elimination of lead-bearing solder in electrical and electronic products. Solder simultaneously connects electronic components both electrically and mechanically.
The absence of lead in solder can alter its mechanical characteristics appreciably enough that failures can begin to occur in previously sound electronic designs. Manufacturers are challenged to balance the
competing goals of rapid compliance with RoHS, no degradation in the mechanical performance of their updated products, and the cost-effective implementation of the RoHS-driven product modifications.
To assist these manufacturers, MSI can virtually evaluate the consequences of the substitution of RoHS-compliant materials in Printed Circuit Boards (PCBs), power supplies, and other
electronic product designs. By simulating the effects of environmental loads on the electronic products accurately, the resulting mechanical stresses, strains, deflections, and fatigue lives of the components
can be predicted with confidence, and any impending product failures subsequently can be identified. Hence the electronic product designs can be modified effectively well in advance of the conductance of compliance
/ acceptance testing to ensure a smooth entry into a competitive marketplace.
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