Electronic Systems Finite Element Analysis (FEA)

MSI takes full advantage of today's leading finite element analysis packages including ANSYS, ANSYS CFX, NEiNastran, Pro/Mechanica, and FEMAP to properly set up and analyze complex problems. FEA can be used to check for potential problems before a product is manufactured or it can be used to analyze existing products that have failed.

Components Analyzed:

• Electronic Packaging

Types of Analysis:

• 3D Contact
• Cracking
• Failure
• Fatigue
• Heat Transfer - Steady and Transient
• Large Deformation
• Linear and Non-Linear Capability
• Plastic Flow
• Stress